October 2024:FINETECH JAPAN 2024

October 2024:CEATEC 2024

August 2024:Innovation Japan 2024

June 2024:The Total Solution Exhibition for Electronic Equipment 2024

May 2024:OPEN HOUSE 2024

February 2024:PV EXPO 2024

January 2024:nano tech 2024

January 2024:38th INTERNEPCON JAPAN

December 2023:SEMICON Japan 2023

October 2023:CEATEC 2023

October 2023:FINETECH JAPAN 2023

August 2023:Innovation Japan 2023

June 2023:OPEN HOUSE 2023

May 2023:The Total Solution Exhibition for Electronic Equipment 2023

February 2023:nano tech 2023

January 2023:37th INTERNEPCON JAPAN

December 2022:SEMICON Japan 2022

December 2022:FINETECH JAPAN 2022

October 2022:CEATEC 2022

October 2022:Innovation Japan 2022

June 2022
The Total Solution Exhibition for Electronic Equipment 2022

May 2022:OPEN HOUSE 2022

January 2022:nano tech 2022/Advanced Printing Technology Exhibition 2022/neo functional material 2022

January 2022:36th INTERNEPCON JAPAN/23th IC & Sensor Packaging Technology EXPO/23th ELECTRONIC COMPONENTS & MATERIALS EXPO/23th Printed Wiring Boards Expo/12th FINE PROCESS TECHNOLOGY EXPOO

December 2021:SEMICON Japan 2021

December 2021:FINETECH JAPAN 2021

October 2021:The Total Solution Exhibition for Electronic Equipment 2021

October 2021:CEATEC 2021

August 2021:Innovation Japan 2021

June 2019:OPEN HOUSE 2021

March 2021:PV EXPO 2021

January 2021:35th INTERNEPCON JAPAN/35th ELECTROTEST JAPAN/22st IC & Sensor Packaging Technology EXPO/22st ELECTRONIC COMPONENTS & MATERIALS EXPO/22st Printed Wiring Boards Expo/11th FINE PROCESS TECHNOLOGY EXPO/13th LED & Laser Diode Technology EXPO

December 2020:nano tech 2021/Advanced Printing Technology Exhibition 2021/neo functional material 2021

December 2020:FINETECH JAPAN 2020

October 2020:CEATEC 2020

September 2020:Innovation Japan 2020

January 2020:nano tech 2020/Advanced Printing Technology Exhibition 2020/neo functional material 2020/JFex2020

January 2020:34th INTERNEPCON JAPAN/34th ELECTROTEST JAPAN/21st IC & Sensor Packaging Technology EXPO/21st ELECTRONIC COMPONENTS & MATERIALS EXPO/21st Printed Wiring Boards Expo/10th FINE PROCESS TECHNOLOGY EXPO/12th LED & Laser Diode Technology EXPO

December 2019:SEMICON Japan 2019

December 2019:FINETECH JAPAN 2019

November 2019:Inter BEE 2019

October 2019:CEATEC 2019

August 2019:Innovation Japan 2019

June 2019:JPCA Show 2019

May-June 2019:OPEN HOUSE 2019

January 2019:nano tech 2019/Advanced Printing Technology Exhibition 2019/neo functional material 2019/JFex2019

January 2019:NEPCON JAPAN 2019/36th ELECTROTEST JAPAN/20th IC & Sensor Packaging Technology EXPO/20th ELECTRONIC COMPONENTS & MATERIALS EXPO/PWB EXPO/20th Printed Wiring Boards Expo/9th FINE PROCESS TECHNOLOGY EXPO

October 2018:CEATEC JAPAN 2018

August 2018:Innovation Japan 2018

June 2018:JPCA Show 2018

May 2018:OPEN HOUSE 2018

February 2018:nano tech 2018

January 2018:NEPCON JAPAN 2018/35th ELECTROTEST JAPAN/19th IC & Sensor Packaging Technology EXPO/19th ELECTRONIC COMPONENTS & MATERIALS EXPO/PWB EXPO 19th Printed Wiring Boards Expo/8th FINE PROCESS TECHNOLOGY EXPO

December 2018:SEMICON JAPAN 2018

December 2018:FINETECH JAPAN 2018


October 2017:CEATEC JAPAN 2017

August 2017:Innovation Japan 2017

June 2017:JPCA Show 2017

April 2017:FINETECH JAPAN 2017

February, 2017:nano tech 2017

January, 2017:NEPCON JAPAN 2017-46th/Electronics R&D and Manufacturing Technology Expo

October, 2016:CEATEC JAPAN 2016

August, 2016:Innovation Japan 2016

April, 2016:26th FINETECH JAPAN/7th FilmTech JAPAN/5th PLASTIC JAPAN

January, 2016:nano tech 2016

January, 2016:INTERNEPCON JAPAN/IC PACKAGING TECHNOLOGY EXPO/PWB EXPO/Light-Tech Expo