■Ritsumeikan University:PFAS Decomposed into Fluoride Ions Using Low-Toxicity Semiconductor Nanomaterials
■Nagoya University Researchers Achieve Sub-Nanometer Thickness Control of Amorphous Silica Nanosheets
■JSR and IBM to Strengthen Semiconductor Materials Development Using AI
■SCREEN Acquires Nikon's R&D Business for Wafer Bonding Technology
■BASF to Build Electronic-Grade Ammonium Hydroxide Plant in Ludwigshafen, Germany
■YKK AP Begins Demonstration of Grid-Connected Interior Windows Using Glass-Type Perovskite Solar Cells for Building-Integrated Photovoltaics
■Waseda University and Toin University of Yokohama Develop Upconversion-Type Perovskite Solar Cells Capable of Utilizing Near-Infrared Light
■NEDO and JAIST Sign Memorandum of Understanding on Industry-Academia Collaboration
■Waseda University Develops a Method to Narrow the Search Space for Predicting Organic Molecular Crystal Structures Using Machine Learning
■Rigaku Establishes Group Company in Taiwan and Launches Full-Scale Operations at New Technology Center
■Sekisui Chemical, NTT DATA, and Nikkei Engineering Develop Improved Installation Method for Film-Type Perovskite Solar Cells on Building Walls
■Tohoku University, National Institutes of Natural Sciences, and Tokyo University of Science discovered a single-atom difference boosts room-temperature luminescence efficiency by 77 times in silver nanoclusters
■Fujifilm Launches Advanced Packaging CMP Slurry
■Tamura and Tohoku University established the “Tamura × Tohoku Univ. Advanced Power Electronics Co-creation Research Center”
■NEG's Ultra-thin Glass Adopted for HONOR's Foldable Smartphone
■Resonac Launches 27-Member "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging
■DIC Builds New Epoxy Resins Production Facility at its Chiba Plant
■NEG's Ultra-thin Glass "Dinorex UTG" Adopted for Xiaomi's Foldable Smartphone
■Fujifilm Develops PFAS-Free Negative ArF Immersion Resist
■DNP operates 2,500 mm-width coating line for large-scale TVs
■Hamamatsu Photonics completes a new building at the Ichino Factory to enhance the production capacity of optical semiconductor devices
■SCREEN PE Solutions Launches Direct Imaging System for Patterning