■NEG's Ultra-thin Glass Adopted for HONOR's Foldable Smartphone
■Resonac Launches 27-Member "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging
■DIC Builds New Epoxy Resins Production Facility at its Chiba Plant
■NEG's Ultra-thin Glass "Dinorex UTG" Adopted for Xiaomi's Foldable Smartphone
■Fujifilm Develops PFAS-Free Negative ArF Immersion Resist
■DNP operates 2,500 mm-width coating line for large-scale TVs
■Hamamatsu Photonics completes a new building at the Ichino Factory to enhance the production capacity of optical semiconductor devices
■SCREEN PE Solutions Launches Direct Imaging System for Patterning
■Asahi Kasei launches new series of dry film photoresist as material for back-end processing of advanced semiconductor packaging
■Fujifilm Signs MOU with Tata Electronics to Build Semiconductor Materials Ecosystem in India
■TEL Completes Construction of New Development Building in Miyagi
■Sharp reaches an agreement with Aoi Electronics on transfer of Sharp Mie Plant No.1.
■SN Tech builts new plant for collection and recycling of developer used in semiconductor manufacturing