■UBE and Tohoku University Establish the Co-creation Research Institute for Future Driven Technologies
■Canon achieves world first with novel inkjet-based wafer planarization, delivering dramatically smoother wafer surfaces
■Nikon Begins Construction of a New Building at Tochigi Nikon
■Tokyo Metropolitan Bureau of Transportation Launches Pilot Program Introducing AI-Powered Transparent Translation Displays on Toei Buses
■Ritsumeikan and SCREEN Sign Partnership and Cooperation Agreement
■ROHM and Tata Electronics Form Strategic Partnership in the Semiconductor Business
■Toray Develops Photo definable Polyimide Sheet for Next-Gen Semiconductors
■TOPPAN to Launch New FC-BGA Substrate Line at Niigata Plant
■Nagase and Nippon Express Sign Memorandum on Supply of Semiconductor Materials for Semiconductor Front-End Process in Dholera, India
■SCREEN to establish an R&D center in Albany, New York for semiconductor production processes
■TOPPAN to Install Pilot Line for Advanced Semiconductor Packaging at Ishikawa Plant
■Fujifilm Launches a New Brand of Photosensitive Insulating Materials Enhancing Reliability in Semiconductor Packaging
■Nikon Introduces a Next-Generation Alignment Station Designed to Facilitate Breakthrough Overlay Accuracy
■SCREEN releases a new direct imaging system delivering industry-leading precision
■AGC exits business in specialty glass for chemical strengthening