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JPCA Show 2018 (June 6-8, 2018)


JPCA Show 2018 New movement in the direct exposure system attracts someone's attention

June 6-8, JPCA Show 2018 were held in Tokyo Big Sight. Main topics in this exhibition are picked up.

First of all, SCREEN PE Solutions merchandised a direct exposure system gLANZANh for PCB enormously.

In this system, world highest resolution same as 8 ƒÊm order can be gained by an original exposure engine, which was newly developed this time. And also, it's possible to treat at one-pass operation by scanning 5 exposure heads at the same time. Furthermore, throughput was enhanced by non-stop alignment method.

Direct DLP exposure system for the screen mask will be released near future


Picture 1. The screen mask which was pilot-manufactured by the direct exposure
On the other hand, Seria Corporation appealed a direct exposure system for the screen mask. The company will release at this autumn not only this system, but also a screen mask, which will be manufactured by this system.

This system is based on DLP (Digital Light Processing) technology. In this system, coated photosensitive emulsion on the screen mesh is directly exposed by irradiation of ON/OFF controlled UV light. In short, an original photo mask is not necessary. Users can self-manufacture a screen mask at will. System price is considered to be 40 - 50 million yen. The tact time is depend on pattern resolution, for example, 400 ~ 500 ‡o size is approximate 20 minutes. As picture 1, a screen mask (frame size 400 ~ 500 ‡o) was exhibited in the booth.

Cured Cu paste in atmosphere appeared on the scene


Picture 2. Printed sample of Cu paste
With respect to electric materials, Goo Chemical introduced a Cu paste which was cured in atmosphere environment, for the screen printing method. In spite of use of the conventional ƒÊm size powder in this paste, after printing, practical specific resistance same as 2 ~ 10-5ƒ¶¥cm is gained by annealing at 150 Ž for 30 minutes in atmosphere environment. However, cured film is not composed of only Cu, is inclusive of an organic binder for securement of dispersibility. Typical density is 89 %, and viscosity is 100 Pa¥s.

Plastic film sample with printed fine Cu pattern (L&S 30 ƒÊm/30 ƒÊm) was exhibited in the booth. The company demonstrated that this material was suitable for a low thermal resistance substrate such as a plastic film.

Rotary type IGZO sputtering target was exhibited


Picture 3. Rotary type IGZO sputtering target
Mitsui Mining & Smelting exhibited a IGZO (In-Ga-Zn-O) sputtering target for rotary sputtering deposition process. In the deposition process, this rotary target is rotated, as a result, sputtering erosion is uniformed. For this reason, high utilization ratio same as 70 - 80 % is gained. This is almost double value of the planer target. Exhibited product is 400 ‡o width and 4N purity. As you can image easily, this product is used in the mass-production line of display makers.


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