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SEMICON Japan 2019 (December 11-13, 2019)


SEMICON Japan 2019 New infrastructures for flexible device were remarkable

December 11-13, SEMICON Japan 2019 was held in Tokyo Big Site. Main topics of display in this exhibition are picked up.


Picture 1. Transparent PI film
As concerns materials for flexible device, Taiyo Holdings exhibited a transparent polyimide film. 102 series (t15ƒΚ‚, 50ƒΚ‚, and 80ƒΚ‚) and 401 series (t40ƒΚ‚) were lined up for transparent and flexible use and high hardness respectively. The former has not only high light transmission (91.5 % and over), but also, high heat resistance (Td1%:457Ž). Linear expansion coefficient of 102 and 401 is 30 - 35ppm/Ž and 10ppm/Ž respectively. The both samples can be supplied at shape of roll (maximum 200 ‡o width).

Laser lift-off system is effective for release process of micro-LED and flexible OLED

On the other hand, Beams introduced a laser lift-off system for micro-LED, flexible OLED, and so on. In this process, a manufactured device on the original substrate is released from the original substrate by scanning irradiation of line shape laser beam. As figure 1, in case of micro-LED, a sapphire substrate is released from GaN layer by irradiation of laser (wavelength 193 nm, 248 nm, 266 nm) from reverse plane, as a result, it's possible to release damage-free.


Figure 1. Process image of micro-LED
By contrast, in case of flexible display such as OLED, a manufactured device on the original substrate is released by irradiating laser beam (wavelength 308 nm) from reverse plane of the original glass substrate. The company is releasing R & D system and mass-production system, too.

REMARK
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Stella will run a booth at 37th ELECTROTEST JAPAN which will be held in Tokyo Big Sight on Jan 15 (Wed) - 17 (Fri), 2020. Our booth is W3-56.