■Advantest & Toray Engineering Establish Technical Partnership in Micro LED Manufacturing
■Resonac Increases Capacity to Produce Materials for AI Chips
■Dexerials operates Dexerials Photonics Solutions Corporation as integrated company leading growth in the photonics domain
■DIC Develops Basic Technology for an Innovative Epoxy Resin Curing Agent
■SCREEN to Acquire 100% Share of Phoenix Seiko, a Company Which Specializes in Plastic Processing
■Dexerials extends the second Kanuma Plant in Kanuma City
■DNP and UBE to Promote Collaboration Through a Joint Venture with the Aim of Creating New Value in Materials Analysis Field
■Fujifilm Starts Full-Scale Operation of its Production Facility for CMP slurries Used in Semiconductor Process
■Toray Creates Ultra-High Tensile Strength Film Comparable to Stainless Steel
■Fujifilm to Invest 6 Billion Yen in its Kumamoto Site for New Advanced Semiconductor Materials Production Facility
■NIPPON STEEL Chemical & Material decided to merge its three wholly-owned subsidiaries
■Nissin Ion Equipment developed the world's first semiconductor material modification machine
■SCREEN Develops Coater/dryer System for Advanced Semiconductor Packaging
■Elephantech and LITEON Technology Partner for Innovative Technology and a Sustainable Future
■Toray Develops Cd-Free Organic Color Conversion Sheet with Wide Color Gamut and High Luminance to Extend Applications to TVs and Monitors
■AGC Achieves Success in Demonstration Test of Solar Panel Cover Glass Recycling
■Canon releases Nanoimprint lithography semiconductor manufacturing system