■AGC acquires global operations of the Advanced Dielectric Division of US-based Taconic
■AGC Releases Glass Substrate for AR/MR Glasses
■USHIO merges with USHIO OPTO SEMICONDUCTORS
■SCREEN changes trade name of Japanese domestic group companies
■Nikon ASML AND Carl Zeiss Sign Agreement to Settle All Litigation
■EBARA Constructs New Automated Plant for Dry Vacuum Pumps
■JDI commence mass production of capacitance type glass fingerprint sensor
■Fujifilm to invest approximately 10 billion yen in U.S. sites to further expand the semiconductor materials business
■Mitsubishi Electric to Launch 10.4-inch SVGA TFT-LCD with Projected Capacitive Touch Panels
■Mitsui Mining & Smelting to Establish New Marketing Base for Copper Foil Business in China
■Mitsui Kinzoku Completes Increase of Production Capacity for Ultra-Thin Electrodeposited Copper Foil with Carrier
■Idemitsu Kosan Constructs an OLED materials plant in China
■AGC to Further Expand its Supply System for EUVL Mask Blanks
■Mitsubishi Electric Establishes Mass-production Technology for Curved Color TFT-LCD and Begins Taking Orders