■Fujifilm Develops PFAS-Free Negative ArF Immersion Resist
■DNP operates 2,500 mm-width coating line for large-scale TVs
■Hamamatsu Photonics completes a new building at the Ichino Factory to enhance the production capacity of optical semiconductor devices
■SCREEN PE Solutions Launches Direct Imaging System for Patterning
■Asahi Kasei launches new series of dry film photoresist as material for back-end processing of advanced semiconductor packaging
■Fujifilm Signs MOU with Tata Electronics to Build Semiconductor Materials Ecosystem in India
■TEL Completes Construction of New Development Building in Miyagi
■Sharp reaches an agreement with Aoi Electronics on transfer of Sharp Mie Plant No.1.
■SN Tech builts new plant for collection and recycling of developer used in semiconductor manufacturing
■JDI ends production at Mobara Fab by March 2026
■Fujifilm to Invest 4 Billion yen in Belgium for CMP Slurries and Photolithography-related Materials
■Sumitomo Heavy Industries Expands Global Semiconductor Footprint With Acquisitin of Laser Systems & Solutions of Europe
■DNP Develops Light Diffuser Film for Mini-LED Displays that Improves LED Elements Appearance
■SEKISUI CHEMICAL decides to mass-produce Perovskite Solar Cells
■Ushio launches atmospheric pressure plasma irradiation unit, one of the smallest unit sizes in the industry
■Fujifilm to Enhance its Production Capacity of CMP Slurries at the Kumamoto Site
■UBE Decides to Increase Production Capacity of High-purity Nitric Acid for Semiconductor