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FPD/PCB NEWS`October 14
 

Tohoku University, National Institutes of Natural Sciences, and Tokyo University of Science
Discovery: A single-atom difference boosts room-temperature luminescence efficiency by 77 times in silver nanoclustersry

A research group led by Professor Yuichi Negishi and Assistant Professor Sourav Biswas from the Institute of Multidisciplinary Research for Advanced Materials at Tohoku University, Professor Masahiro Ehara from the Center for Computational Sciences, National Institutes of Natural Sciences/The Graduate University for Advanced Studies (SOKENDAI), and Professor Junpei Yuasa from the Faculty of Science, Tokyo University of Science, has successfully synthesized two types of high-nuclearity silver nanoclusters (Ag NCs) containing 78 and 79 atoms (Ag78 and Ag79) using anion-templated synthesis.

Although the two nanoclusters have nearly identical frameworks, Ag79, which has just one more silver atom in its outer shell than Ag78, exhibits a 77-fold increase in photoluminescence quantum yield at room temperature.

The dramatic improvement in luminescence efficiency was revealed, through both experimental and theoretical analyses, to arise from the combined effects of (1) enhanced radiative transitions due to reduced symmetry and (2) suppressed structural fluctuations resulting from changes in the ligand environment. This achievement provides new insight showing that ga difference of just one atom can dramatically alter luminescent properties.h

FPD/PCB NEWS`October 8
 

Fujifilm Launches Advanced Packaging CMP Slurry

FUJIFILM announced the launch of CMP slurry for advanced packaging, enabling the integration of multiple semiconductor chips into a single package. This product has been adopted by a major semiconductor device manufacturer as an essential abrasive for planarizing bonding surfaces in hybrid bonding, one of the advanced packaging technologies key to enhancing AI semiconductor performance.

The newly launched product is an evolution of Fujifilm's front-end copper interconnect CMP slurry, optimized for advanced packaging. The formulation of additives, corrosion inhibitors, and abrasives has been refined to achieve high-precision planarization of hybrid bonding surfaces, where copper and oxide films coexist.

FPD/PCB NEWS`October 1
 

Tamura and Tohoku University established the gTamura ~ Tohoku Univ. Advanced Power Electronics Co-creation Research Centerh

Tamura Corporation and Tohoku University have jointly established the gTamura ~ Tohoku Univ. Advanced Power Electronics Co-creation Research Centerh at the University's Material Solution Center (MaSC).

The Co-creation Research Center aims to drive research and development of innovative materials, components, devices, and modules that contribute to creating new value in the power electronics market.

FPD/PCB NEWS`September 10
 

NEG's Ultra-thin Glass Adopted for HONOR's Foldable Smartphone
Nippon Electric (NEG) announced that its ultra-thin glass sheet designed exclusively for chemical strengthening, Dinorex UTG, has been adopted for the cover of inner main display of HONOR's latest foldable smartphone, the Magic V Flip2.

HONOR was established in 2013 as a sub-brand of Huawei and became an independent company in 2020. For the Magic V Flip2, Dinorex UTG has been adopted for the cover of inner main display. Despite being thinner than a human's hair, it boasts outstanding reliability, having withstood 200,000 folding tests. The product delivers both durability and display quality indispensable for foldable smartphones.

FPD/PCB NEWS`September 3
 

Resonac Launches 27-Member "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging

Resonac announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc.

These companies will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board using a prototype production line for the manufacture of 515 x 510mm panel-level organic interposers.

Resonac will establish an "Advanced Panel Level Interposer Center (APLIC)" as the main hub for this initiative within its Shimodate Plant (Minami-yuki) in Yuki City, Ibaraki Prefecture. APLIC will house the prototype production line, which is scheduled to commence operations in 2026.

FPD/PCB NEWS`August 4
 

DIC Builds New Epoxy Resins Production Facility at its Chiba Plant

DIC announced to build a new epoxy resins production facility at its Chiba Plant, located in the city of Ichihara, Chiba Prefecture.

The decision to make this investment reflects the fact that the investment plan has been approved as a gplan for ensuring stable supplyh by the Ministry of Economy, Trade and Industry (METI) under Japan's Act on the Promotion of Ensuring National Security through Integrated Implementation of Economic Measures, as a result of which DIC is expected to receive a subsidy of up to \3 billion.

FPD/PCB NEWS`July 24
 

NEG's Ultra-thin Glass "Dinorex UTG" Adopted for Xiaomi's Foldable Smartphone
Nippon Electric Glass (NEG) announced that its ultra-thin glass for chemical strengthening, Dinorex UTG has been adopted for Xiaomi's new foldable smartphone, the Xiaomi MIX Flip 2.

The main display on the inner side of the Xiaomi MIX Flip 2 features our ultra-thin glass for chemical strengthening, "Dinorex UTG." Dinorex UTG is highly regarded for its quality and reliability, and following its adoption by Motorola, it has now been adopted by Xiaomi as well, further expanding its adoption in the foldable smartphone market.

FPD/PCB NEWS`July 15
 

Fujifilm Develops PFAS-Free Negative ArF Immersion Resist

FUJIFILM announced to develop a PFAS-free negative-type ArF immersion resist for use in advanced semiconductor manufacturing processes.

The new PFAS-free ArF immersion resist is a photoresist designed for negative-type ArF immersion exposure. In collaboration with imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, Fujifilm evaluated the performance of this resist and successfully demonstrated its ability to achieve high yields in forming 28nm generation metal wiring, widely used in applications such as automotive and industrial semiconductors. Moving forward, Fujifilm aims to proceed with customer evaluations and target early commercialization.

FPD/PCB NEWS`June 18
 

DNP operates 2,500 mm-width coating line for large-scale TVs
Dai Nippon Printing (DNP) announced the September operational launch of a coating device compatible with 2,500 mm-width high functional optical film at our Mihara Plant in Hiroshima Prefecture.

The operational launch of the second wide coating device comes in response to market and consumer needs, and will boost production capacity by more than 15% on an area basis. With the increased capacity, DNP will accommodate the demand for high functional optical film for 65-inch large-screen TVs, which are expected to increase at a compound annual growth rate (CAGR) of approximately 6% between 2025 and 20301 on an area basis.

FPD/PCB NEWS`June 17
 

Hamamatsu Photonics completes a new building at the Ichino Factory to enhance the production capacity of optical semiconductor devices

Hamamatsu Photonics announced to construct a new building at their main factory (Ichino-cho, Chuo-ku, Hamamatsu City) dedicated to front-end opto-semiconductor manufacturing. The building has now been completed and is scheduled to begin operations in December 2025.