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FPD/PCB NEWS`September 10
 

NEG's Ultra-thin Glass Adopted for HONOR's Foldable Smartphone
Nippon Electric (NEG) announced that its ultra-thin glass sheet designed exclusively for chemical strengthening, Dinorex UTG, has been adopted for the cover of inner main display of HONOR's latest foldable smartphone, the Magic V Flip2.

HONOR was established in 2013 as a sub-brand of Huawei and became an independent company in 2020. For the Magic V Flip2, Dinorex UTG has been adopted for the cover of inner main display. Despite being thinner than a human's hair, it boasts outstanding reliability, having withstood 200,000 folding tests. The product delivers both durability and display quality indispensable for foldable smartphones.

FPD/PCB NEWS`September 3
 

Resonac Launches 27-Member "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging

Resonac announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc.

These companies will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board using a prototype production line for the manufacture of 515 x 510mm panel-level organic interposers.

Resonac will establish an "Advanced Panel Level Interposer Center (APLIC)" as the main hub for this initiative within its Shimodate Plant (Minami-yuki) in Yuki City, Ibaraki Prefecture. APLIC will house the prototype production line, which is scheduled to commence operations in 2026.

FPD/PCB NEWS`August 4
 

DIC Builds New Epoxy Resins Production Facility at its Chiba Plant

DIC announced to build a new epoxy resins production facility at its Chiba Plant, located in the city of Ichihara, Chiba Prefecture.

The decision to make this investment reflects the fact that the investment plan has been approved as a gplan for ensuring stable supplyh by the Ministry of Economy, Trade and Industry (METI) under Japan's Act on the Promotion of Ensuring National Security through Integrated Implementation of Economic Measures, as a result of which DIC is expected to receive a subsidy of up to \3 billion.

FPD/PCB NEWS`July 24
 

NEG's Ultra-thin Glass "Dinorex UTG" Adopted for Xiaomi's Foldable Smartphone
Nippon Electric Glass (NEG) announced that its ultra-thin glass for chemical strengthening, Dinorex UTG has been adopted for Xiaomi's new foldable smartphone, the Xiaomi MIX Flip 2.

The main display on the inner side of the Xiaomi MIX Flip 2 features our ultra-thin glass for chemical strengthening, "Dinorex UTG." Dinorex UTG is highly regarded for its quality and reliability, and following its adoption by Motorola, it has now been adopted by Xiaomi as well, further expanding its adoption in the foldable smartphone market.

FPD/PCB NEWS`July 15
 

Fujifilm Develops PFAS-Free Negative ArF Immersion Resist

FUJIFILM announced to develop a PFAS-free negative-type ArF immersion resist for use in advanced semiconductor manufacturing processes.

The new PFAS-free ArF immersion resist is a photoresist designed for negative-type ArF immersion exposure. In collaboration with imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, Fujifilm evaluated the performance of this resist and successfully demonstrated its ability to achieve high yields in forming 28nm generation metal wiring, widely used in applications such as automotive and industrial semiconductors. Moving forward, Fujifilm aims to proceed with customer evaluations and target early commercialization.

FPD/PCB NEWS`June 18
 

DNP operates 2,500 mm-width coating line for large-scale TVs
Dai Nippon Printing (DNP) announced the September operational launch of a coating device compatible with 2,500 mm-width high functional optical film at our Mihara Plant in Hiroshima Prefecture.

The operational launch of the second wide coating device comes in response to market and consumer needs, and will boost production capacity by more than 15% on an area basis. With the increased capacity, DNP will accommodate the demand for high functional optical film for 65-inch large-screen TVs, which are expected to increase at a compound annual growth rate (CAGR) of approximately 6% between 2025 and 20301 on an area basis.

FPD/PCB NEWS`June 17
 

Hamamatsu Photonics completes a new building at the Ichino Factory to enhance the production capacity of optical semiconductor devices

Hamamatsu Photonics announced to construct a new building at their main factory (Ichino-cho, Chuo-ku, Hamamatsu City) dedicated to front-end opto-semiconductor manufacturing. The building has now been completed and is scheduled to begin operations in December 2025.