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FPD/PCB NEWS～December 23
 

ROHM and Tata Electronics Form Strategic Partnership in the Semiconductor Business

ROHM and Tata Electronics (India) have entered into a strategic partnership for semiconductor manufacturing in India for both Indian and global markets. This partnership aims to leverage the expertise and ecosystem of both the companies in order to expand business opportunities for both ROHM and Tata Electronics, thereby further strengthening the relationship between the semiconductor industries of Japan and India.

As an initial focus, ROHM and Tata Electronics will establish a manufacturing framework for power semiconductors in India by combining ROHM's leading device technologies with the advanced backend technologies of Tata Electronics. In addition, by integrating the sales channels and networks, the partnership will create new business opportunities in the Indian market and deliver higher-value solutions to a wide range of customers.

As the first step in this collaboration, Tata Electronics will assemble and test ROHM's India-designed automotive-grade Nch 100V, 300A Si MOSFET in a TOLL package, targeting mass production shipments by next year. The companies will also explore co-development of high-value packaging technologies in the future.

FPD/PCB NEWS～December 22
 

Toray Develops Photo definable Polyimide Sheet for Next-Gen Semiconductors
Toray Industries announced to develop a negative photo definable polyimide sheet for glass core substrates in semiconductor manufacturing processes.

This sheet makes it possible to simultaneously microfabricate the redistribution layer and fill through-glass via electrodes (TGVs) with resin. This material shortens processes and cuts costs because it enables void-free resin filling of TGVs with conformally plated copper. Substrate manufacturers have started evaluating samples from Toray. The company looks to start mass production from the fiscal year beginning in April 2026.

FPD/PCB NEWS～December 18
 

TOPPAN to Launch New FC-BGA Substrate Line at Niigata Plant
TOPPAN announced to construct a new manufacturing line at its Niigata Plant (Shibata, Niigata Prefecture, Japan) for Flip Chip-Ball Grid Array (FC-BGA) substrates, a form of high-density semiconductor packaging. The new line will come online in January 2026.

The launch of the new manufacturing line will bolster TOPPAN's capabilities for high-end FC-BGAs large-scale, multilayer substrates delivering high-speed transmission needed for AI and data center semiconductors. FC-BGA production capacity at the Niigata Plant will reach double the fiscal 2022 first half level.

FPD/PCB NEWS～December 18
 

Nagase and Nippon Express Sign Memorandum on Supply of Semiconductor Materials for Semiconductor Front-End Process in Dholera, India

Nagase and NIPPON EXPRESS HOLDINGS have signed a memorandum on initiatives for providing semiconductor materials for the semiconductor front end process in Dholera, India.

Both companies will cooperate to build the semiconductor supply chain and strengthen relationships with local customers in Dholera, where there has been a rapid increase in investments in semiconductor plants, and contribute to the development of India's domestic semiconductor industry.

FPD/PCB NEWS～December 17
 

SCREEN to establish an R&D center in Albany, New York for semiconductor production processes
SCREEN Holdings announced the establishment of a new research and development center, “SCREEN Advanced Technology Center of America, LLC”(ATCA), in Albany, New York, with the aim of reinforcing its product competitiveness in the semiconductor production equipment business.

The newly established ATCA, in collaboration with NY Creates (New York Center for Research, Economic Advancement, Technology, Engineering and Science Corp), will be located within the state-of-the-art Albany NanoTech Complex, North America's most advanced non-profit semiconductor R&D center. ATCA will occupy 929 m2 of clean room and 462 m2 of office space.

ATCA will expand SCREEN's capacity and capability to engage with a broad range of industry stakeholders including, global customers, consortia, universities, technology and material suppliers, and the other globally recognized tenants of the Albany NanoTech Complex.

FPD/PCB NEWS～December 16
 

TOPPAN to Install Pilot Line for Advanced Semiconductor Packaging at Ishikawa Plant
TOPPAN announced to install a pilot line to conduct research and development of advanced semiconductor packaging at the Ishikawa Plant (Nomi, Ishikawa Prefecture, Japan) acquired in 2023, aiming to commission the line in July 2026.

Utilizing the new pilot line, TOPPAN will verify technologies for future mass production by pursuing R&D on components required for advanced semiconductor packaging, such as interposers using large glass substates as well as glass cores and organic RDL interposers.

FPD/PCB NEWS～December 15
 

Fujifilm Launches a New Brand of Photosensitive Insulating Materials Enhancing Reliability in Semiconductor Packaging

FUJIFILM announced the launch of “ZEMATES”, a new brand of photosensitive insulating materials for semiconductor back-end processes, centered on polyimide.

The ZEMATES product lineup consists of liquid-type polyimide for redistribution layers (RDL) and protective films, film-type polyimide for redistribution layers and PBO (polybenzoxazole) for use in protective films. These products are used as insulating layer materials in semiconductor packaging processes, covering a wide range from power semiconductors to high-performance AI semiconductors.

FPD/PCB NEWS～December 12
 

Nikon Introduces a Next-Generation Alignment Station Designed to Facilitate Breakthrough Overlay Accuracy
Nikon announced the development of the Litho Booster 1000, its latest alignment station model engineered to enable exceptional overlay accuracy in semiconductor manufacturing.

The Litho Booster 1000 provides dense sampling measurements on each wafer and feeds forward precise correction data directly to the lithography system before exposure, improving process control and delivering higher production yield. Nikon expects to launch the system in the second half of 2026.

FPD/PCB NEWS～December 10
 

SCREEN releases a new direct imaging system delivering industry-leading precision

SCREEN Semiconductor Solutions (SCREEN SPE) has finalized development of the DW-3100, a cutting-edge direct imaging system for advanced semiconductor packages. Sales of the new system will begin this month.

Like its predecessor, the DW-3000, the DW-3100 employs SCREEN's proprietary GLVTM technology to deliver high-precision, high-throughput maskless exposure. It also achieves an industry-leading resolution of below 1 μm thanks to its fully redesigned optical system.

In addition, the DW-3100 incorporates proprietary correction technologies for image processing that detect wafer warpage, distortion, and chip misalignment, enabling optimal exposure for each wafer and chip.

FPD/PCB NEWS～December 8
 

AGC exits business in specialty glass for chemical strengthening

AGC announced to exit business in specialty glass for chemical strengthening. Manufacturing of this product at the Takasago Factory (Takasago City, Hyogo Prefecture) is scheduled to end in the third quarter of 2026.

FPD/PCB NEWS～December 4
 

Chuden Kogyo, The Chugoku Electric Power Company, and YKK AP
Begin Demonstration Test of Building-Integrated Photovoltaics Using Perovskite Solar Cells

Chuden Kogyo, The Chugoku Electric Power Company, and YKK AP have launched a demonstration project for building-integrated photovoltaics (BIPV) using perovskite solar cells.

At Yamayama-Mita, a community interaction space in Minami-ku, Hiroshima City?developed by Chuden Kogyo since April as a field for co-creating the future of the region?the companies have installed “HIROSHIMA ZERO BOX,” a demonstration house featuring BIPV developed by YKK AP. The house incorporates building-integrated solar power systems using perovskite solar cells embedded in interior windows, as well as various other types of solar panels. Electricity generated will be used to power lighting and air conditioning within the house.

FPD/PCB NEWS～December 3
 

Fujibo Holdings to Expand Abrasive Material Manufacturing Facilities

Fujibo Holdings has announced that its consolidated subsidiary, Fujibo Ehime, will strengthen its abrasive material manufacturing facilities. The investment amount is approximately 8.7 billion yen.

A new building will be constructed on the premises of the Fujibo Ehime Head Office Mibukawa Plant (Saijo City, Ehime Prefecture), and an additional production line for soft pads-an abrasive material product will be installed. Completion is scheduled for the second half of fiscal 2028.

FPD/PCB NEWS～November 28
 

Sumitomo Chemical Reaches Agreement to Acquire Taiwanese Semiconductor Process Chemicals Company

Sumitomo Chemical annouced to enter into a definitive agreement to acquire 100% of the shares of Asia Union Electronic Chemical (“AUECC”), a Taiwanese semiconductor process chemicals company. The transaction is subject to customary closing conditions, including obtaining required regulatory approvals.

FPD/PCB NEWS～November 25
 

Fujifilm Announces Completion of a New Building for Advanced Semiconductor Materials in Shizuoka
FUJIFILM Corporation announced the successful completion of a new building for development and evaluation at the Shizuoka Factory of FUJIFILM Electronic Materials (FFEM), the core company that leads Fujifilm's semiconductor materials business, with operations commencing in November.

The new building at the Shizuoka Factory is equipped with state-of-the-art evaluation equipment in a high-cleanliness cleanroom, enhancing quality evaluation functions for development and production. AI image recognition technology has been introduced to inspect fine particles contained in semiconductor materials, improving analysis accuracy and establishing an advanced quality control system utilizing AI. Furthermore, a department promoting digital transformation (DX) has been established in the new building to support the expansion of digital technologies such as AI in manufacturing processes, thereby improving product quality and ensuring stable supply.

FPD/PCB NEWS～November 21
 

TEL Construction Completed on Tokyo Electron Technology Solutions'Tohoku Production and Logistics Center
Tokyo Electron (TEL) announced the completion of the Tohoku Production and Logistics Center at its development/manufacturing subsidiary, Tokyo Electron Technology Solutions, in Oshu City, Iwate Prefecture. A completion ceremony was held earlier today.

The new building is a hybrid logistics center that combines production and warehouse functions. By consolidating logistics warehouses presented in and around the prefecture and improving production efficiency, the center will reduce lead times and solve operational problems in production and logistics, including human resource shortages and the implementation of business continuity planning. This will make the operations more flexible, efficient, and responsive.

FPD/PCB NEWS～November 17
 

EBARA to Establish Second Overhaul Plant for Dry Vacuum Pumps in Korea

Ebara Precision Machinery Korea Incorporated (EPMK), a subsidiary of EBARA CORPORATION, is to construct a second overhaul (OH) plant for dry vacuum pumps in Pyeongtaek, Gyeonggi Province, Republic of Korea. This initiative will further enhance EBARA's supply structure and after-sales service capabilities in the Korean market.

FPD/PCB NEWS～November 12
 

SATO Develops Printing-Based RFID Antenna Manufacturing Technology Using Conventional Micron-Sized Copper Paste
SATO has announced the development of a printing-based RFID antenna manufacturing technology that utilizes copper (Cu) paste made from commonly used micron-sized copper powder.

Compared to conventional methods that use aluminum (Al) or silver (Ag) pastes, the new technology achieves higher conductivity and stable quality suitable for mass production, while also reducing manufacturing costs. The company is exploring applications and mass production possibilities in fields such as circuit fabrication, sensor development, and solar cell substrate wiring formation, and is also considering co-creation with partner companies.

FPD/PCB NEWS～November 7
 

Ritsumeikan University:PFAS Decomposed into Fluoride Ions Using Low-Toxicity Semiconductor Nanomaterials

A research team led by Professor Yoichi Kobayashi of the College of Life Sciences at Ritsumeikan University, together with Shuhei Kanao, a master's student in the Graduate School of Life Sciences, has successfully decomposed and detoxified “forever chemicals” known as PFAS (per-and polyfluoroalkyl substances)?which pose environmental and health risks. Specifically, they achieved the breakdown of perfluorooctanoic acid (PFOA), which is internationally regulated, and perfluorooctanesulfonic acid (PFOS), known for its extreme resistance to degradation.

The team demonstrated that by combining low-toxicity, inexpensive, and mass-producible zinc oxide (ZnO) semiconductor nanocrystals with a commercially available near-ultraviolet LED light source, PFAS can be decomposed into fluoride ions under ambient temperature and pressure conditions.

The resulting fluoride ions can be reused as fluorspar (calcium fluoride), the mineral raw material used in industry.

FPD/PCB NEWS～November 6
 

Nagoya University Researchers Achieve Sub-Nanometer Thickness Control of Amorphous Silica Nanosheets

A research group led by Assistant Professor Eisuke Yamamoto and Professor Minoru Nagata at the Institute of Materials and Systems for Sustainability (IMaSS), Nagoya University, has successfully synthesized amorphous silica nanosheets whose thickness can be precisely controlled at the sub-nanometer level, using a solid-phase surfactant templating method.

By employing solid-phase surfactants containing polyethylene oxide (PEO) chains as templates, the researchers were able to freely tune the nanosheet thickness through molecular design of the surfactants. The resulting nanosheets exhibited high dispersion stability, and it was confirmed that they could form densely packed two-dimensional films.

Further investigation into the influence of nanosheet thickness on their properties revealed that, although the band gap remained constant regardless of thickness, thinner nanosheets showed higher dielectric breakdown strength.

FPD/PCB NEWS～November 5
 

JSR and IBM to Strengthen Semiconductor Materials Development Using AI

JSR and IBM have signed a Joint Research Agreement to launch a collaborative research program focused on AI for the chemical industry.

Through the expansion of foundation models specialized in materials development and the utilization of generative AI to enhance data infrastructure, the two companies aim to build an integrated platform for managing diverse material systems. They also plan to conduct joint research to establish knowledge frameworks that enable the understanding and modeling of a wide variety of material representations.

FPD/PCB NEWS～November 4
 

SCREEN Acquires Nikon's R&D Business for Wafer Bonding Technology

SCREEN Holdings announced to acquire Nikon's research and development business related to wafer bonding technology.

SCREEN positions the advanced packaging field as a key strategic area and has been promoting the development and implementation of low-temperature wafer bonding technologies, in addition to marketing direct imaging systems and coater/dryers. Through this acquisition, SCREEN aims to integrate Nikon's ultra-high-precision bonding technologies and expertise with its own existing technologies, pursuing the realization of world-leading wafer bonding capabilities.