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FPD/PCB NEWS～June 18
 

DNP operates 2,500 mm-width coating line for large-scale TVs
Dai Nippon Printing (DNP) announced the September operational launch of a coating device compatible with 2,500 mm-width high functional optical film at our Mihara Plant in Hiroshima Prefecture.

The operational launch of the second wide coating device comes in response to market and consumer needs, and will boost production capacity by more than 15% on an area basis. With the increased capacity, DNP will accommodate the demand for high functional optical film for 65-inch large-screen TVs, which are expected to increase at a compound annual growth rate (CAGR) of approximately 6% between 2025 and 20301 on an area basis.

FPD/PCB NEWS～June 17
 

Hamamatsu Photonics completes a new building at the Ichino Factory to enhance the production capacity of optical semiconductor devices

Hamamatsu Photonics announced to construct a new building at their main factory (Ichino-cho, Chuo-ku, Hamamatsu City) dedicated to front-end opto-semiconductor manufacturing. The building has now been completed and is scheduled to begin operations in December 2025.

FPD/PCB NEWS～May 29
 

SCREEN PE Solutions Launches Direct Imaging System for Patterning

SCREEN PE Solutions (SCREEN PE) announced to develop a new direct imaging system called “LUPIOS” for mid-range package substrates. The product will be released for sales in October 2025.

FPD/PCB NEWS～May 26
 

Asahi Kasei launches new series of dry film photoresist as material for back-end processing of advanced semiconductor packaging

Asahi Kasei announced to develop the TA Series of Sunfort dry film photoresist as a new product designed to meet growing demand in the field of advanced semiconductor packages used in applications such as artificial intelligence (AI) servers.

This product is positioned as a strategic offering within Asahi Kasei's Material sector, aiming to strengthen its footprint in the rapidly growing market for next-generation chip packaging. The dry film delivers an ultra-high resolution with conventional stepper exposure systems and laser direct imaging (LDI) systems, which transfer circuit patterns onto substrates during packaging, contributing to enhanced performance and precision in back-end processes.

FPD/PCB NEWS～May 7
 

Fujifilm Signs MOU with Tata Electronics to Build Semiconductor Materials Ecosystem in India

FUJIFILM announced to sign a Memorandum of Understanding (MOU) with Tata Electronics, a leading electronics manufacturing company, for partnership to establish semiconductor material production and supply chain in India.

Fujifilm will contribute to the formation of a semiconductor materials ecosystem in India by developing and providing semiconductor materials that meet the needs of Tata Electronics, which is currently constructing India's first semiconductor front-end manufacturing plant and a large-scale semiconductor back-end manufacturing plant.