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FPD/PCB NEWS`May 26
 

Asahi Kasei launches new series of dry film photoresist as material for back-end processing of advanced semiconductor packaging

Asahi Kasei announced to develop the TA Series of Sunfort dry film photoresist as a new product designed to meet growing demand in the field of advanced semiconductor packages used in applications such as artificial intelligence (AI) servers.

This product is positioned as a strategic offering within Asahi Kasei's Material sector, aiming to strengthen its footprint in the rapidly growing market for next-generation chip packaging. The dry film delivers an ultra-high resolution with conventional stepper exposure systems and laser direct imaging (LDI) systems, which transfer circuit patterns onto substrates during packaging, contributing to enhanced performance and precision in back-end processes.

FPD/PCB NEWS`May 7
 

Fujifilm Signs MOU with Tata Electronics to Build Semiconductor Materials Ecosystem in India

FUJIFILM announced to sign a Memorandum of Understanding (MOU) with Tata Electronics, a leading electronics manufacturing company, for partnership to establish semiconductor material production and supply chain in India.

Fujifilm will contribute to the formation of a semiconductor materials ecosystem in India by developing and providing semiconductor materials that meet the needs of Tata Electronics, which is currently constructing India's first semiconductor front-end manufacturing plant and a large-scale semiconductor back-end manufacturing plant.

FPD/PCB NEWS`April 24
 

TEL Completes Construction of New Development Building in Miyagi
Tokyo Electron (TEL) announced that its development and manufacturing subsidiary, Tokyo Electron Miyagi (Taiwa-cho, Miyagi) has completed its new development building (Development Building No. 3). Construction cost is approx. 52 billion yen.

FPD/PCB NEWS`March 31
 

Sharp reaches an agreement with Aoi Electronics on transfer of Sharp Mie Plant No.1

Sharp announced to reach an agreement with Aoi Electronics on the transfer of Sharp Mie Plant No.1.

Through Sharp Display Technology, Sharp's subsidiary in charge of small and medium size LCD business, Sharp will collaborate with Aoi Electronics on the construction of their production line for semiconductor back-end processes, while discussing the transfer of Mie Plant No.2 in relation to their business development.

FPD/PCB NEWS`March 19
 

SN Tech builts new plant for collection and recycling of developer used in semiconductor manufacturing

SN Tech, a joint venture between Nagase, Nagase ChemteX and SACHEM builts a new plant, theSN Tech Higashiosaka 2nd Plant, in Higashiosaka to collect and recycle the high-purity developer used in the manufacture of semiconductors.

This project, which collects and recycles the high-purity developer used in the manufacture of semiconductors (tetramethylammonium hydroxide:TMAH), is the first case in Japan of collecting, recycling, and selling used TMAH. Mass production is planned to begin during FY2025.

FPD/PCB NEWS`February 17
 

JDI ends production at Mobara Fab by March 2026

Japan Display (JDI) announced to end production at its Mobara Fab by March 2026. JDI plans to turn the Mobara Fab into an AI data center after production ends.

In addition, JDI will consolidate production to its Ishikawa Fab and turn the Ishikawa Fab into a MULTI-FAB capable of simultaneously producing advanced G4.5 and G6 substrate displays, advanced sensors, and advanced semiconductor packaging via a highly flexible, productive, and cost-competitive production system that serves a broad array of customers and product needs.

FPD/PCB NEWS`February 5
 

Fujifilm to Invest 4 Billion yen in Belgium for CMP Slurries and Photolithography-related Materials

FUJIFILM announced to install new production facilities of CMP slurries, advanced semiconductor materials, and enhance existing facilities for photolithography-related materials at its production site located in Belgium.

FUJIFILM Electronic Materials (Europe) N.V., Fujifilm's semiconductor materials subsidiary in Europe, is making a capital investment of approximately 4 billion yen (approx. 25 million EUR). It introduces new production facilities for CMP slurries, which are used in advanced semiconductors and are expected to show a high annual growth rate of 13%.

The new CMP slurry production facilities and the enhanced developer production facilities are both scheduled to start operation in the spring of 2026.

FPD/PCB NEWS`January 28
 

Sumitomo Heavy Industries Expands Global Semiconductor Footprint With Acquisitin of Laser Systems & Solutions of Europe

Sumitomo Heavy Industries (SHI) announced the completion of the acquisition of Laser Systems & Solutions of Europe SASU (LASSE), a French company specialising in cutting-edge laser annealing equipment for semiconductor manufacturing.

FPD/PCB NEWS`January 21
 

Mitsubishi Materials and Panasonic promote a sustainable PMP (Product-Material-Product) loop using waste PCB

Mitsubishi Materials and Panasonic announced to establish and operate a PMP (Product-Material-Product) loop, which reutilizes gold, silver, and copper recovered from waste printed circuit boards of discarded home appliances, primarily within the Panasonic Group.

This PMP loop is the industry's first scheme to achieve consistent resource recycling, through which urban mine resources have been reused, reaching cumulative totals of 1.1 tons of gold, 33 tons of silver, and 8,100 tons of copper.

FPD/PCB NEWS`January 16
 

DNP Develops Light Diffuser Film for Mini-LED Displays that Improves LED Elements Appearance


LeftFwith light diffuser Film, rightFwithout light diffuser Film
Ushio announced to launch "Lamina 5," an atmospheric pressure plasma irradiation unit, which achieves dramatic reduction in unit size by adopting a unique electrode structure.

Lamina 5 with an irradiation width of 550mm is now added to the existing Lamina 3A (irradiation width of 300mm) as part of the Lamina series, making it possible to handle large substrates such as the SEMI standard 510 ~ 515mm.