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FPD/PCB NEWS`August 4
 

DIC Builds New Epoxy Resins Production Facility at its Chiba Plant

DIC announced to build a new epoxy resins production facility at its Chiba Plant, located in the city of Ichihara, Chiba Prefecture.

The decision to make this investment reflects the fact that the investment plan has been approved as a gplan for ensuring stable supplyh by the Ministry of Economy, Trade and Industry (METI) under Japan's Act on the Promotion of Ensuring National Security through Integrated Implementation of Economic Measures, as a result of which DIC is expected to receive a subsidy of up to \3 billion.

FPD/PCB NEWS`July 24
 

NEG's Ultra-thin Glass "Dinorex UTG" Adopted for Xiaomi's Foldable Smartphone
Nippon Electric Glass (NEG) announced that its ultra-thin glass for chemical strengthening, Dinorex UTG has been adopted for Xiaomi's new foldable smartphone, the Xiaomi MIX Flip 2.

The main display on the inner side of the Xiaomi MIX Flip 2 features our ultra-thin glass for chemical strengthening, "Dinorex UTG." Dinorex UTG is highly regarded for its quality and reliability, and following its adoption by Motorola, it has now been adopted by Xiaomi as well, further expanding its adoption in the foldable smartphone market.

FPD/PCB NEWS`July 15
 

Fujifilm Develops PFAS-Free Negative ArF Immersion Resist

FUJIFILM announced to develop a PFAS-free negative-type ArF immersion resist for use in advanced semiconductor manufacturing processes.

The new PFAS-free ArF immersion resist is a photoresist designed for negative-type ArF immersion exposure. In collaboration with imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, Fujifilm evaluated the performance of this resist and successfully demonstrated its ability to achieve high yields in forming 28nm generation metal wiring, widely used in applications such as automotive and industrial semiconductors. Moving forward, Fujifilm aims to proceed with customer evaluations and target early commercialization.

FPD/PCB NEWS`June 18
 

DNP operates 2,500 mm-width coating line for large-scale TVs
Dai Nippon Printing (DNP) announced the September operational launch of a coating device compatible with 2,500 mm-width high functional optical film at our Mihara Plant in Hiroshima Prefecture.

The operational launch of the second wide coating device comes in response to market and consumer needs, and will boost production capacity by more than 15% on an area basis. With the increased capacity, DNP will accommodate the demand for high functional optical film for 65-inch large-screen TVs, which are expected to increase at a compound annual growth rate (CAGR) of approximately 6% between 2025 and 20301 on an area basis.

FPD/PCB NEWS`June 17
 

Hamamatsu Photonics completes a new building at the Ichino Factory to enhance the production capacity of optical semiconductor devices

Hamamatsu Photonics announced to construct a new building at their main factory (Ichino-cho, Chuo-ku, Hamamatsu City) dedicated to front-end opto-semiconductor manufacturing. The building has now been completed and is scheduled to begin operations in December 2025.