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Manufacturing process of a-Si TFT-LCD 2024 edition


Explain a-Si TFT-LCD Manufacturing process by illustration

Full-cover from basic process to next generation process

Explain TFT structure, and process flow of TFT array, CF array, LC cell, and module assemble.

Cover 3D technology of with and without glasses method

Easy to look at the file using any PC because of the format of browser, for example IE (Internet Explorer)

Possible to access at will from Index Page to detail page

Describe these illustrations at 3D image

Number of total file are 63 (about 150 page in A4 form equivalent)

Illustrations of device structure and process flow are approximately 270.

CONTENT

■Structure of a-Si TFT-LCD

■Liquid crystal material and display mechanism

■TFT array process
Etch-stopped layer type
Back-channel-etched type (5 masks)
Back-channel-etched type (4 masks)
Forming process of gate electrode
Forming process of gate insulator film, a-Si film, and etching stopper film (Etch-stopped layer type)
Forming process of a-Si island, S/D electrode(Etch-stopped layer type)
Forming process of data line and S/D electrode
Forming process of passivation layer and contact hole
Forming process of pixel electrode
Forming process of gate insulator film, a-Si, n+ a-Si layer (Back-channel-etched type：5 mask)
Forming process of S/D electrode, n+ a-Si island (Back-channel-etched type：5 mask)
Forming process of gate insulator film, Si channel, and S/D electrode (Back-channel-etched type：4 mask)

■CF (Color filter) forming process
Manufacturing process of CF for IPS mode/FFS mode TFT-LCD
Manufacturing process of CF for VA mode TFT-LCD
Manufacturing process of CF for TN/OCB mode TFT-LCD
Black matrix forming process
Manufacturing process of R, G, B color layer
Manufacturing process of overcoat layer
Deposition process of opposite electrode
Manufacturing process of post-spacer
Manufacturing process of rib (bump)
Photo-alignment process (for MVA mode TFT-LCD)

■LC cell process
Polyimid coating process
Alignment process
Seal layer forming process
Dispersion process of spacer-ball
Making panel thinner process
Scribe and break process
Filling process of LC material
ODF (One drop fill) process

■Module assemble process
Connect panel and driver-IC

■Structure of backlight module
Side light type
Light guide plate technology
Structure of direct type
LED backlight for TV (Direct type, side light type)

■3D technology
Method to use a specific glasses
LC shutter glasses method (Time sequential method)
Polarized glasses ＋ patterned phase difference film (Space division method)

Specific glasses-free method
Parallax barrier method
Parallax barrier using dual emission OLED
Time sequential driving ＋ parallax LC barrier method
Lenticular lens method
Time sequential twin-lens 3D-OCB method
Lenticular ＋ time sequential scanning backlight method


▲Process flow of 4 PEP a-Si TFT


▲Structure of TAB and COF


▲Structure of BL module


▲3D technology sample

Full-original CD-ROM

CD-ROM for Windows ＆ Macintosh
Price：22,000 yen (free shipping)
Release date：May 13, 2024

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