Fine Vision provides you very effective, powerful, yet handy functions such as a unique contour hemming, offset command with recognizing inside and outside of objects. It is equipped with multiple select functions so that you may use variety and favorable ways to select specific data in the most effective way. Technical editing by logical operation and calculation of overlapped objects. Automatic elaborate design and super fine Etching data by just simple parameter input, Etching data linear offset correction with keeping minimum clearance and in accord with data shape,
Distance Offset
Please see the execution result of Distance Offset. The distance is calculated keeping a minimum clearance with the adjoining object, and the amount of the offset is calculated.
It enables the offset amount to be changed according to the objects location.By using Distance Offset, the etching correction can be executed as what you require in a short time.
Looking at distance with adjoining data, it is altogether automatic, internal calculation is carried out, and a result is made to reflect. Of course, since it performs maintaining the minimum clearance value, a result which is not realistic is not brought. Furthermore, the whole data can be divided into some area and a separate setting value can also be prepared in each. The command and it which can apply the optimal offset to any places free are Distance Offset.
Simulation Software “Etching Process Simulator” (Optional)
We have succeeded to develop a simulation software “Etching Process Simulator “which is possible to forecast pattern form of photoresist film after exposure and development in advance, as an assisted tool of the exposure process by making use of photomask. This development is realized by adopting of new algorithm on the original CAD/CAM software (Stella Vision) technology. Therefore, we are releasing this etching simulator software as an assisted manufacturing tool for ultra-fine pattern such as a dozen nm (optional).
Figure 1 Simulation sample
As you know, design rule of semiconductor device is shrunk year by year, however, in the fine design rule from exposure wavelength on down, if a photomask is manufactured by making use of original design data, same exposure pattern such as the original design data is not gained. Therefore, OPC (Optical Proximity Correction) which is calibrated technology of photomask pattern is used in general, to correspond the original design pattern with exposure pattern. In this time, we have developed original simulation software by development of a novel algorithm based on OPC technology. If you make use of this software, you can manufacture an optimized photomask for ultra-fine pattern easily.
Figure 1 shows simulation sample image. In this figure, inside purple line is forecast pattern of photoresist after exposure and development, on the other hand, outside sky-blue line is calibration pattern for acquirement of the original pattern. In short, line with becomes to be slightly finer after development by over-development. Of course, calibration level of form is optimized automatically in parallel with placement.
Figure 2 shows an example of simulation result, figure 3 shows patterned photoresist pattern in fact by the laser etching method. You can see the former is almost same as the latter in the ultra-fine pattern such as a few dozen nm.
At the moment, we focus on an assisted tool of exposure process firstly because of early stage of development; however, we will expand its territory as real complete pattern for devices in the future. In short, in this software, pattern of device after dry-etching is forecasted, and then, pattern of photomask is calibrated. Of course, progress of dry-etching and final pattern form are forecasted by input of process parameter, for example, sort of etching gas, flow rate of etching gas, pressure in the vacuum chamber, and etc.
It is the function in an etching process which creates compensation data
automatically.
Data can be changed freely.
It is also possible to perform all at once in an enclosure by the frame.
Etching Factor
Change of the form of only a tip portion is also possible in changing and
offsetting the form of a leadframe.
Put Horn
his function changes the corner pattern of lead frames, putting out horns
of drawing in them as shown below.
Sample Image (Detail)
Calculation of sheet resistance of electrode (Optional)
Stella has developed calculation software of sheet resistance of electrode automatically as a design tool of electrode pattern.
Once-time, shape of electrode is limited to stripe line, but it could support all shapes of electrode by new algorithm.
This is world first, as a result, it is possible to apply PM-LCD, PM-OLED, design assist tool of FPC, and so on.
We released this software as optional software of Stella Vision for Java.
In this software, first of all, you design electrode pattern by PC. Subsequently, you input sheet resistance correspond to electrode material and its thickness.
And then, you indicate measurement area by mouse click. As a result, you can see sheet resistance for 10 sec(picture 1).
As above, shape of electrode is limited to stripe line, but it could support all shapes of electrode involved curved line by new algorithm.
In this software, it's possible to change electrode design, such as bending shape and etching by manual operation.
In this case, it's possible to changed calculate sheet resistance at once.
We upgraded these functions; as a result, we succeeded to develop new automatic adjustment function of sheet resistance. This function makes it possible to uniform sheet resistance of all electrode lines based on above calculation. In concretely, it uniforms sheet resistance by arrangement of width of electrode line while keeping space between line and line. In this time, it can uniform sheet resistance because by arrange width of electrode in one block area while keeping width of electrode in another block area. In short, it is possible to keep design which is almost same one at physical appearance. In this case, if the data is simple, it is enough time to complete for less than 30 sec.
Paraline/Correct Pitch
Stella Vision for Java is equipped with the bunch line (parallel line) drawing command, which draws the bunch line smoothly, and the pitch correcting command for the drawn bunch line after the drawing. Furthermore, Stella Vision for Java is equipped with the change corner shape of parallel line command, add or move corner of parallel line command, connect parallel line command, etc. It also has the detect clearance of segments command which inspects the width and the space of parallel line in an instant.
Paraline
It is possible to change the distance from the baseline, the width of the bunch line, the space between the bunch lines. As the set-up by the mouse cursor is available, the foregoing change can be executed instantly by the easy operation.
Using the adjust area function,the electric resistance would be unified on each.
Correct Pitch
[Correct Pitch] command enables you to edit the bunch line after the drawing
and it is possible to change the width, space, and pitch of the bunch lines as your wishes. The edit operation can be executed faster because you can edit the plural bunch lines at one time.
