FINETECH JAPAN 2025/16th FILMTECH JAPAN/14th PLASTIC JAPAN/12th Metal Japan
Fresh innovations in materials and equipment for Micro-LED and flexible device applications

December 12 - 14, FINETECH JAPAN 2025/16th FILMTECH JAPAN/14th PLASTIC JAPAN/12th Metal Japan were held in Makuhari Messe. Main topics about material in these exhibitions are picked up.

Promoting Particle-Aligned ACF for Micro LED Applications

Pic.1 Micro-LED using particle-aligned type ACF

Dexerials has introduced a particle-aligned anisotropic conductive film (ACF) for bonding Micro-LED chips to substrate glass. Unlike conventional particle-dispersed ACFs, this new type arranges conductive particles in a uniform pitch. Because of this precise alignment, the film maintains consistent contact performance even with fine-pitch connections, minimizing short-circuit defects. The typical particle diameter ranges from 2.2 to 3.5 μm, and alignment is achieved through a deliberate method such as photolithography, not by self-alignment.

Photo 1 shows a green monochrome display made up of 50 × 50 green LED chips, each measuring 26 × 40 μm, emitting uniform light across the entire surface. The company also exhibited a 1.5-inch, 256 × 256 full-color panel prototyped by Taiwanese Micro-LED specialist PlayNitride, primarily targeting smartwatch applications.

Encapsulating Organic Film Solar Cells with Dual Gas-Barrier Films

Pic.2 Encapsulated organic film solar cell by Roll to Roll method in atmosphere

In the field of flexible solar cells, Reiko showcased a high-barrier film suitable for roll-to-roll lamination. This barrier film consists of a PET base laminated with a coating and barrier layer, achieving a water vapor transmission rate (WVTR) of 5×^-3g/m²/day even under harsh conditions of 85℃ and 85%RH.

By encapsulating organic thin film solar cell panels between two sheets of this barrier film under atmospheric conditions via roll-to-roll processing, high productivity can be achieved. At the booth, the company displayed both 300×300 mm samples and 300 mm-wide flexible organic film solar cells, emphasizing that flexible, high gas-barrier solar cells can be manufactured relatively easily.

Cu Wiring with Improved Oxidation Resistance Using MOD Paste

Pic.3 Printed sample on polyimide film

For printable electronics, Sumitomo Metal Mining introduced a Cu-based MOD (metal organic decomposition) paste. After printing onto a substrate, Cu wiring is formed either by thermal sintering at 200℃ or photo-sintering with an Xe flash lamp.

The film surface is covered by organic compounds after sintering, which suppresses oxidation. As a result, the wiring retains stable resistivity even when heated in air at 180℃, forming low-resistance, oxidation-resistant Cu lines with resistivity values of 10^-5〜10^-6Ω・cm, close to pure copper. The company demonstrated screen-printed samples on PET film, showing fine patterning capability down to L&S = 30 μm / 30 μm.

High-Reflective White Insulating Material for Mini-LED Brightness Enhancement

Pic.4 Mini-LED backlight module with printed white insulator material

For Mini-LED backlight units essential components in high-end LCD TVs?Taiyo Ink Mfg highlighted its high-reflective insulating material “PX-500 DW Series”.

In Photo 4, a 34-inch Mini-LED backlight module manufactured by BOE is shown. By coating its surface with this material, overall luminance is enhanced, with the material's own reflectivity reaching 94.8%.

New Cover Sheet Optimized for Automotive Instrument Panels

Pic.5 Instrument panel system with covered Polomo silicon OCA

In the automotive display segment, China's POLOMO showcased its optical bonding OCA, a silicone-based transparent sheet ranging from 20 to 2000 μm in thickness. It offers visible light transmittance above 99% and withstands temperatures up to 120℃.

This makes it ideal for display cover films in vehicle systems requiring high thermal resistance. At the booth, the company exhibited an ultra-wide curved display system for instrument panels (Photo 5) and emphasized that the product is already in mass production for automakers and in-vehicle equipment manufacturers.

Laser Scribing System for Ultra-Thin Glass and Flexible Films

Pic.6 Laser cut polyimide film

In manufacturing equipment, Globally Tech promoted a laser glass-cutting system optimized for ultra-thin glass substrates. Using ultrashort-pulse picosecond lasers, the system irradiates the scribe line to achieve microcrack-free scribing.

This makes it particularly effective for cutting extremely thin glass (0.03?0.1 mm), where microcracks can be fatal. The cutting speed reaches 400 mm/sec, with ±80 μm precision in linearity. Moreover, by optimizing process conditions, the system can also cut polyimide films, plastic substrates, and multi-layer coated materials, highlighting its high versatility.