COF and TAB process flow and our product

COF process flow
Stella product
TAB process flow

Device structure

  

Device structure

①Draw up CAD data
CAD/CAM system“Fine Vision for JAVA”
①Draw up CAD data

②Etch Cu film by half


  
②Punch

③Coat a photo-resist or laminate DFR


  
③Laminate copper foil

④Expose by UV light
←Measure and inspect after exposure
Measuring ＆ AOI inspection system “ST series”

④Coat a photo-resist or laminate DFR

⑤Develop photo-resist film


←Measure and inspect after development
Measuring ＆ AOI inspection system “ST series”

Measure and inspect after exposure→
Measuring ＆ AOI inspection system “ST series”

⑤Expose by UV light

⑥Wet-etch Cu film

←Measure and inspect after etching
Measuring ＆ AOI inspection system “ST series”

Measure and inspect after development→
Measuring ＆ AOI inspection system “ST series”

⑥Develop photo-resist film

⑦Strip photo-resist film

←Measure and inspect after stripping
Measuring ＆ AOI inspection system “ST series”

Measure and inspect after etching→
Measuring ＆ AOI inspection system “ST series”

⑦Wet-etch Cu film
  Measure and inspect after stripping→
Measuring ＆ AOI inspection system “ST series”

⑧Strip photo-resist film

Stella Corporation Co., Ltd.
1-1544-7 Kaijincho Minami, Funabashi, Chiba, Japan Zip: 273-0024
Tel: +81-(0)47-432-5031
Fax: +81-(0)47-432-5032
e-Mail support@stellacorp.co.jp
https://www.stellacorp.co.jp