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FPD/PCB NEWS～July 24
 

NEG's Ultra-thin Glass "Dinorex UTG" Adopted for Xiaomi's Foldable Smartphone
Nippon Electric Glass (NEG) announced that its ultra-thin glass for chemical strengthening, Dinorex UTG has been adopted for Xiaomi's new foldable smartphone, the Xiaomi MIX Flip 2.

The main display on the inner side of the Xiaomi MIX Flip 2 features our ultra-thin glass for chemical strengthening, "Dinorex UTG." Dinorex UTG is highly regarded for its quality and reliability, and following its adoption by Motorola, it has now been adopted by Xiaomi as well, further expanding its adoption in the foldable smartphone market.

FPD/PCB NEWS～July 15
 

Fujifilm Develops PFAS-Free Negative ArF Immersion Resist

FUJIFILM announced to develop a PFAS-free negative-type ArF immersion resist for use in advanced semiconductor manufacturing processes.

The new PFAS-free ArF immersion resist is a photoresist designed for negative-type ArF immersion exposure. In collaboration with imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, Fujifilm evaluated the performance of this resist and successfully demonstrated its ability to achieve high yields in forming 28nm generation metal wiring, widely used in applications such as automotive and industrial semiconductors. Moving forward, Fujifilm aims to proceed with customer evaluations and target early commercialization.