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FPD/PCB NEWS`September 30
 

Fujifilm to Invest 20 Billion yen in Japan to Expand Semiconductor Materials Business

FUJIFILM announced an investment of 20 billion yen in its semiconductor materials business to further strengthen its facilities for the development, production and quality evaluation of advanced semiconductor materials in Shizuoka and Oita, Japan. The total amount of capital investment is approximately 20 billion yen.

At the Shizuoka site, FUJIFILM Electronic Materials invests approximately 13 billion yen to construct a new building to strengthen the development, production and quality evaluation functions for advanced photoresists, including photoresists for extreme ultraviolet lithography(EUV), and WAVE CONTROL MOSAIC. The new building will be equipped with the clean room and state-of-the-art inspection equipment.

At the Oita site, FUJIFILM Electronic Materials invests approximately 7 billion yen to construct a new building, acquiring land adjacent to the existing site. It will introduce additional production equipment and inspection devices for post-CMP cleaners, which are key materials in the semiconductor manufacturing process. This will expand the production capacity at the Oita site by approximately 40%.

The new building at the Shizuoka site is scheduled to begin operations in the fall of 2025, and the new building at the Oita site is scheduled to begin operations in the spring of 2026.

FPD/PCB NEWS`September 26
 

Canon delivers nanoimprint lithography system for semiconductor manufacturing to the Texas Institute for Electronics
Canon announced to ship advanced lithography platform, the FPA-1200NZ2C nanoimprint lithography (NIL) system for semiconductor manufacturing, to the Texas Institute for Electronics (TIE), a Texas-based semiconductor consortium, on September 26, 2024.

This FPA-1200NZ2C will be used at TIE for the research and development of advanced semiconductors and production of prototypes.

FPD/PCB NEWS`September 24
 

Sony Semiconductor Solutions to Release 0.44-Type Full HD OLED Microdisplay
Sony Semiconductor Solutions Corporation announced the upcoming release of the ECX350F, a 0.44-type Full HD resolution OLED Microdisplay that combines the industry's smallest 5.1 ƒÊm pixels (approximately 5,000 ppi) with the industry's highest brightness of up to 10,000 cd/m2.

The ECX350F is an OLED Microdisplay designed for use in augmented reality (AR) glasses, an application which demands a thin, lightweight form factor without compromising visibility. Adopting a novel OLED structure and microlenses, the microdisplay enhances pixel light emission despite its diminutive size. This innovation allows for Full HD resolution within a compact 0.44-inch panel while delivering a peak brightness of 10,000 cd/m2 approximately double that of the conventional model.

FPD/PCB NEWS`September 2
 

AGC Establishes a New Technical Service Site in Taiwan for Chemical Products Focused on Semiconductor and Electronic Materials

AGC announced the opening of the AGC Chemicals Technical Center in Hsinchu, Taiwan, in October 2024. This center will provide technical services for chemical products focused on semiconductor and electronic materials.

The building at gTai Yuen Hi-Tech Industrial Parkh where the new technical center will be located, Hsinchu, Taiwan. The building at gTai Yuen Hi-Tech Industrial Parkh where the new technical center will be located, Hsinchu, Taiwan.