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FPD/PCB NEWS～March 29


Resonac Increases Capacity to Produce Materials for AI Chips

Resonac announced to increase its capacity to produce materials for high-performance semiconductor chips, which are to be used mainly as CPUs for artificial intelligence (AI), to 3.5 to 5 times of the current level.

The company will increase production of non-conductive film (NCF) and thermal conductive sheet (thermal interface material:TIM) both of which have already been adopted by Resonac's customers for use in high-performance semiconductor chips. Resonac plans to invest 15 billion yen in facilities to produce these materials and will commence operation of the expanded facilities in and after 2024 step-by-step.

FPD/PCB NEWS～March 22


Dexerials operates Dexerials Photonics Solutions Corporation as integrated company leading growth in the photonics domain

Dexerials announced that the name of the integrated company to be created under Dexerials Precision Components Corporation (DXPC) and Kyoto Semiconductor has been determined as Dexerials Photonics Solutions (DXPS), a consolidated subsidiary of Dexerials in Japan, and that DXPS will commence operation on April 1, 2024.
DXPS will develop and manufacture microdevices and optical semiconductor device products that have been operated by DXPC and Kyoto Semiconductor. Dexerials will sell them to customers as its photonics products.