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FPD/PCB NEWS～February 28


DIC Develops Basic Technology for an Innovative Epoxy Resin Curing Agent

DIC announced that it has succeeded in developing basic technology for a groundbreaking epoxy resin curing agent that resists heat up to over 200℃ and can be recycled. In addition to preserving the outstanding conventional qualities of epoxy resins, including excellent heat resistance, durability and mechanical properties, this new agent will facilitate remolding, making it possible to reuse this traditionally difficult-to-recycle thermosetting plastic.

This agent also makes it possible to reshape molded epoxy products so they can continue to be used for their original intended application, reducing environmental impact over the entire product lifecycle and contributing to the achievement of carbon neutrality. The company aims to advance to the verification test stage by 2027.

FPD/PCB NEWS～February 6


SCREEN to Acquire 100% Share of Phoenix Seiko, a Company Which Specializes in Plastic Processing

SCREEN Semiconductor Solutions (SCREEN SPE), a group company of SCREEN Holdings , has decided to acquire 100% share of Phoenix Seiko, making it a wholly owned subsidiary. Share acquisition is schedule to take place on March 31, 2024.

Phonix Seiko specializes in precision work and unit assembly of plastic products. It is particularly strong in welding of polyvinyl chloride (PVC) products, which are crucial for semiconductor production equipment. The company has been one of the important partner companies of SCREEN SPE for years.

Combining the company's plastic processing technology with SCREEN SPE's cleaning equipment knowhow is expected to bolster the performance of the PVC products used in semiconductor production equipment.