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FPD/PCB NEWS～December 27


NIPPON STEEL Chemical & Material decided to merge its three wholly-owned subsidiaries

NIPPON STEEL Chemical & Material announced that its Board of Directors, at their meeting held on 11/29/2023, resolved to carry out an absorption-type merger of its three wholly-owned subsidiaries, with the effective date of October 1, 2024,and entered into a merger agreement with the Three Consolidated Subsidiaries as described below.

Three Consolidated Subsidiaries are NIPPON STEEL Carbon, NIPPON STEEL Functional Material Manufacturing and NIPPON STEEL Epoxy Manufacturing.

FPD/PCB NEWS～December 19


Nissin Ion Equipment developed the world's first semiconductor material modification machine

Nissin Ion Equipment announced to develop a new semiconductor material modification machine called KYOKA that is capable of mass production in the material modification process that plays a part in the manufacture of semiconductor devices.

KYOKA was designed by applying the company's high-current ion technology developed for smartphone display manufacturing a market dominated by Nissin Ion Equipment and is the world's first machine that satisfies all the various performance requirements for practical application and mass production of material modification, including high throughput and low processing cost. In April 2024, a demonstration machine will be installed at Shiga Plant to begin processing samples for customers.

FPD/PCB NEWS～December 5


SCREEN Develops Coater/dryer System for Advanced Semiconductor Packaging

SCREEN Finetech Solutions announced to develop its new Lemotia coater/dryer system, specifically designed for use in advanced semiconductor packaging of FOPLP, glass core and related substrates. Lemotia is scheduled for release in April 2024 via SCREEN Holdings.

Lemotia brings together all of SCREEN FT's advanced coating technologies and is capable of handling a wide range of chemicals from high to low viscosity, making it ideal for the increasingly complex and high precision FOPLP production process. Each of Lemotia's processing units is also equipped with a mechanism that prevents warping to ensure excellent uniformity during film deposition.

In developing Lemotia, SCREEN FT has completely revamped all aspects of its design, creating a system that is ideally suited for PLP. Compared to SCREEN FT's conventional systems, Lemotia has a 30% smaller footprint and requires 10% less power.