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FPD/PCB NEWS～Ｊuly 6


DNP Enters into development and manufacture of encoder disks

Dai Nippon Printing (DNP) announced to enter into the development and manufacturing of Encoder Disks (ED) employed in electronic components that detect the position, movement direction and rotation angle of industrial robots.

An ED is a disk onto which fine scales have been engraved. Mounted inside the encoder, various sensors detect reflected light on, or transmitted through, the disk, and by converting this into electrical signals detect and control whether industrial robots are moving and rotating in the correct manner.

As factory automation has progressed in recent years, there has been increased demand for encoders capable of detecting the movement and rotation of robot motors. In response to this situation, DNP has decided to enter the development and manufacturing of ED. The company will combine proprietary strengths in precision thin film coating and patterning technology cultivated in connection with the development of a variety of display products.

FPD/PCB NEWS～Ｊune 27


AGC succeeded in the world's first demonstration test of glass production using ammonia as fuel in an actual production furnace

AGC announced that it has recently succeeded in the world's first demonstration test of glass production using ammonia as fuel in an actual production furnace under the project entitled “Technology Development for the Utilization and Production of Ammonia as Fuel”which is being undertaken as a commissioned project by New Energy and Industrial Technology Development Organization (NEDO).

This time, a pair of burners developed by Taiyo Nippon Sanso to prevent a rapid rise in flame temperature through multi-stage combustion were installed in the glass melting furnace (actual production furnace) used to produce architectural glass at the AGC Yokohama Technical Center, and the world's first demonstration test using ammonia as fuel was conducted for two days from June 18 to 19th, 2023.
In the demonstration test, compared with conventional combustion methods using heavy oil as fuel under various conditions, the effects on the quality of glass, furnace materials, and control of the flame temperature, furnace temperature, and NOx emissions were verified. In this test, the NOx concentration in the exhaust gas was found to be below the environmental criterion value while maintaining the required temperature of the glass melting furnace.

FPD/PCB NEWS～Ｊune 13


DNP Increases Number of Wide Range Coating Devices for High Function Optical Film at Mihara plant

Dai Nippon Printing (DNP) announced to increase the number of wide-range coating devices suitable for the manufacture of high function optical film with a maximum width of 2,500 mm. The device has been added at the Mihara plant in Hiroshima prefecture in response to the ongoing shift to large screen televisions.

In this latest development, DNP introduced a new coating device capable of accommodating a 2,500 mm width as a second manufacturing line. As a result, the production capacity, on an area basis, has increased by more than 15%.

The newly added wide-width coating equipment is designed to be able to coat two layers at the same time. As displays become more sophisticated and diversified in the future, multi-layered coatings will become necessary, and DNP will continue to meet the demand for Anti-glare-Low Reflection (AG-LR) film and Low Reflection (LR) film.

FPD/PCB NEWS～Ｊune 2


DIC Acquires Photoresist Polymers Manufacturer PCAS Canada

DIC announced to acquire 100% of the shares of Quebec-based PCAS Canada from French based company PCAS S.A., which manufactures and sells polymers used in photoresists for semiconductor photolithography.

PCAS Canada has since been renamed “Innovation DIC Chimitroniques”. Looking forward, DIC will work to expedite the company's development of products for cutting-edge processes, make capital investments to strengthen its supply capabilities, and create a corporate organization suited to the needs of DIC Group customers in both North America and Asia. Through these efforts, DIC will continue to supply materials that underpin the growth and evolution of the semiconductor industry.