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FPD/PCB NEWS～March 29


E Ink and Sharp Collaborate to Bring ePaper Digital Posters to Market

E Ink Holdings and Sharp announced their collaboration to bring e-Paper posters using E Ink's technology to market. As the first step in this collaboration, Sharp will release their 42-inch monochrome “ePoster” digital paper display in the Japanese market in early April 2023.

FPD/PCB NEWS～March 27


JOLED resolved to file a petition to commence civil rehabilitation

JOLED resolved to file a petition to commence civil rehabilitation proceedings at the Board of Directors meeting held, and filed a petition for the proceedings with the Tokyo District Court, which was accepted on the same day. The Court issued a provisional order prohibiting the payment of debt and a supervision order, and Mr.Eiji Katayama, attorney-at-law of ABE, IKUBO & KATAYAMA, was appointed as the supervisor.

The company also announced to execute a “Basic Agreement” regarding support for the rehabilitation of Technology Development Business with Japan Display.

FPD/PCB NEWS～March 20


TEL builds new building construction for Tokyo Electron Technology Solutions Tohoku Office

Tokyo Electron (TEL) announced a plan to construct the Tohoku Production and Logistics Center (provisional name) at the Tohoku Office (Iwate Prefecture) of its manufacturing subsidiary, Tokyo Electron Technology Solutions, in an effort to meet the recent rise in demand in the semiconductor market. Construction of the Tohoku Production and Logistics Center is scheduled to start in spring 2024 for completion in fall 2025.

FPD/PCB NEWS～March 10


SCREEN Plans to Launch New Ledia 7F-L Large-format Direct Imaging System in April

SCREEN PE Solutions (SCREEN PE) has developed its Ledia 7F-L Direct Imaging System. SCREEN PE has created the new model to support high-precision pattern formation on large-size substrates and metal masks as they see growing demand for, particularly, telecommunications and IoT infrastructure applications. The Ledia 7F-L is scheduled for release in April.

The Ledia 7F-L shares the same precise imaging capabilities that have become so highly regarded by the industry along with SCREEN PE's proprietary wavelength mixing technology. It also achieves a high level of equipment rigidity that ensures consistent positioning accuracy even on large substrates of up to 661 x 813 mm.

FPD/PCB NEWS～March 9


SCREEN Expands Lineup of LeVina Direct Imaging Systems

SCREEN Holdings announced to develop a new model with a resolution of 2 μm for its lineup of LeVina direct imaging systems for next-generation patterning. SCREEN has created its LeVina range specifically to handle IC package substrates and FOPLP, which continue to see growing demand, particularly for 5G, post-5G and IoT infrastructure applications. The new model is scheduled for release in July.

It will inherit the proven high speed stage and advanced scan alignment function of the current model, launched in January 2022, enabling it to provide the same excellent productivity. It will also feature a revamped optical unit with an exposure wavelength set to 375 nm that achieves an industry-leading resolution of 2 μm.

In addition to the IC package substrates usually targeted by LeVina systems, it is anticipated these technologies will allow the new model to produce the advanced semiconductor packages required for FOPLP and chiplets called 2.1D and 2.3D.3 Adopting an exposure wavelength of 375 nm will also enable it to perform exposure for liquid resists, as well as dry film resists.

Once the new model joins the current 405 nm wavelength model in the expanded LeVina lineup, manufacturers will be able to choose a system based on specific materials and applications. Companies that have already installed a 405 nm model will also have the option of replacing the optical unit, allowing them to convert it to a 375 nm wavelength. This will enable the construction of a flexible production line that can be adapted for different applications.