Q. Are there below problems in PCB manufacturing process H
The following table is an example of 4 layered PCB.

Problem and its solution by our software
Process flow sample of multi layered PCB
Problem and its solution by our hardware
It's difficult to read data.
Also, it's impossible to read a data which is based on Gerber format.
The software supports DXF format and ODB { data.
CAD/CAM systemgFine Vision for JAVAh
‡@CAD design
 
It's necessary to commonalize data standard.
End results change because of ununiformed ability of operators.
It's necessary to automatize or semi-automatize work.
CAD/CAM systemgFine Vision for JAVAh
Yield is low.
Distance Offset function
‡ACAM Edit
 
 
‡BDraw up film mask
Manufacture PCB by use of supplied film mask.
Price of supplied film mask is expensive.
It's difficult to shorten delivery time because of outsourcing.
Laser plottergSilverWriterh
 
‡CExpose inside layer
It's desirable to find out defect after exposure.
Position of NC and film is stirred.

Measuring • AOI inspection system gST seriesh
Etching result occurs non-uniformly.
Open and short defects occur often.

Distance Offset function
‡DEtching of inside layer
 
 
‡EInspection of inside layer(AOI)
Interlevel inspection of inside layer
It's desirable for over demand or oversupply to occur in the final inspection.
Inspection by the data comparison method
Measuring • AOI inspection system gST seriesh
Board makes an expansion and contraction
Draw up plotting data correspond to expansion and contraction of board
CAD/CAM systemgFine Vision for JAVAh
Measuring • AOI inspection system gST seriesh
‡FPress of stacked layers
 
NC data
Prepare effective data
CAD/CAM systemgRouter Vision for JAVAh
‡GOpen up NC hole
 
 
‡HPlate with Cu
 
 
‡IExpose outside layer
It's desirable to find out defect after exposure.
Position of NC and the film is stirred.

Measuring • AOI inspection system gST seriesh
Etching result occurs non-uniformly.
Open and short defects occur often.

Distance Offset function
‡JEth outside layer
 
 
‡KInspection of outside layer(AOI)
Interlevel inspection of outside layer
It's desirable for over demand or oversupply to occur in the final inspection.
Inspection by the data comparison method
Measuring • AOI inspection system gST seriesh
 
‡LPrint resist
 
 
‡MPrint by screen printing method
Process management, enhancement of yield
Quality guarantee,@analyzation of defect
It's desirable to compass process accuracy in the all processes and analyze source of trouble.
Prepare data from the film
It's desirable to prepare Gerber data from the film.
It's desirable to calibrate data.
It's desirable to feed back variability, expansion and contraction, strain, measurement result and enhance yield.
Measuring • AOI inspection system gST seriesh
 
‡NPlate solder
Reduce process steps and enhancement of quality
It's desirable prepare data of router processing machine from Gerber data automatically or semi-automatically.
CAD/CAM systemgRouter Vision for JAVAh
‡OFabricate outer shape
 
‡PElectrical inspection

Delivery amount is insufficient because quality depends on the final inspection.Cost of manufacture becomes to be more expensive by oversupply because of low yield.
CAD/CAM systemgFine Vision for JAVAh

‡QFinal inspection

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