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FPD/PCB NEWS～September 10
 

NEG's Ultra-thin Glass Adopted for HONOR's Foldable Smartphone
Nippon Electric (NEG) announced that its ultra-thin glass sheet designed exclusively for chemical strengthening, Dinorex UTG, has been adopted for the cover of inner main display of HONOR's latest foldable smartphone, the Magic V Flip2.

HONOR was established in 2013 as a sub-brand of Huawei and became an independent company in 2020. For the Magic V Flip2, Dinorex UTG has been adopted for the cover of inner main display. Despite being thinner than a human's hair, it boasts outstanding reliability, having withstood 200,000 folding tests. The product delivers both durability and display quality indispensable for foldable smartphones.

FPD/PCB NEWS～September 3
 

Resonac Launches 27-Member "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging

Resonac announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc.

These companies will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board using a prototype production line for the manufacture of 515 x 510mm panel-level organic interposers.

Resonac will establish an "Advanced Panel Level Interposer Center (APLIC)" as the main hub for this initiative within its Shimodate Plant (Minami-yuki) in Yuki City, Ibaraki Prefecture. APLIC will house the prototype production line, which is scheduled to commence operations in 2026.