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FPD/PCB NEWS～May 26
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Asahi Kasei launches new series of dry film photoresist as material for back-end processing of advanced semiconductor packaging Asahi Kasei announced to develop the TA Series of Sunfort dry film photoresist as a new product designed to meet growing demand in the field of advanced semiconductor packages used in applications such as artificial intelligence (AI) servers.This product is positioned as a strategic offering within Asahi Kasei's Material sector, aiming to strengthen its footprint in the rapidly growing market for next-generation chip packaging. The dry film delivers an ultra-high resolution with conventional stepper exposure systems and laser direct imaging (LDI) systems, which transfer circuit patterns onto substrates during packaging, contributing to enhanced performance and precision in back-end processes. |
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FPD/PCB NEWS～May 7
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Fujifilm Signs MOU with Tata Electronics to Build Semiconductor Materials Ecosystem in India FUJIFILM announced to sign a Memorandum of Understanding (MOU) with Tata Electronics, a leading electronics manufacturing company, for partnership to establish semiconductor material production and supply chain in India.Fujifilm will contribute to the formation of a semiconductor materials ecosystem in India by developing and providing semiconductor materials that meet the needs of Tata Electronics, which is currently constructing India's first semiconductor front-end manufacturing plant and a large-scale semiconductor back-end manufacturing plant. |