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FPD/PCB NEWS～April 30


Fujifilm Launches Nanoimprint Resist Compatible with Nanoimprint Lithography

FUJIFILM announced the launch of the Nanoimprint Resist. The Nanoimprint Resist is a semiconductor material compatible with nanoimprint lithography semiconductor manufacturing technology and will be provided in Japan through FUJIFILM Electronics Materials, a core company in the electronic materials business.

The Nanoimprint Resist can quickly and uniformly fill the complex circuit patterns engraved on the mask, and transfer and form nanometer-scale circuit patterns in a short time. Furthermore, after curing by UV radiation, the Nanoimprint Resist shows excellent mold-releasing properties that do not cause loss of circuits even when the mask is removed at high speed. This enables the improvement of throughput and yield improvement due to low defects, which have been issues for the practical application of nanoimprint lithography.

FPD/PCB NEWS～April 15


Advantest & Toray Engineering Establish Technical Partnership in Micro LED Manufacturing

Advantest announced that it has entered into a technical partnership with Toray Engineering to promote efficient production technology for mini/micro LED displays.

In partnering together, the two companies will offer display manufacturers their combined inspection, transfer, and mounting technologies, data analysis technologies, and manufacturing-related technologies, enhancing customer production efficiency that benefits the mini/micro LED display market.

FPD/PCB NEWS～April 9


Shin-Etsu Chemical builds a new production base in Japan which will become its 4th production base for semiconductor lithography materials

Shin-Etsu Chemical announced that in order to expand its semiconductor lithography materials business, the company decided to build a new plant in Isesaki City in Gunma Prefecture, Japan. The new plant will become Shin-Etsu's 4th production base for this business.

Shin-Etsu has acquired an about 150,000 ㎡ business site in the city where it will build a new manufacturing and research-and-development base for semiconductor lithography materials. The company invests in the new plant in phases, with the first phase of investment to be completed by 2026. The investment, including the acquisition of the land, is expected to amount to about \83 billion yen at the completion of the first phase of construction.