COF and TAB process flow and our product

COF process flow
Stella product
TAB process flow

Device structure

 

Device structure




@Draw up CAD data

@Draw up CAD data

AEtch Cu film by half


 
APunch



BCoat a photo-resist or laminate DFR


 
BLaminate copper foil

CExpose by UV light




Measure and inspect after exposure

Measuring AOI inspection system gST seriesh

CCoat a photo-resist or laminate DFR


DDevelop photo-resist film



Measure and inspect after development

Measuring AOI inspection system gST seriesh

Measure and inspect after exposure
Measuring AOI inspection system gST seriesh


DExpose by UV light



EWet-etch Cu film


Measure and inspect after etching
Measuring AOI inspection system gST seriesh

Measure and inspect after development
Measuring AOI inspection system gST seriesh


EDevelop photo-resist film


FStrip photo-resist film



Measure and inspect after stripping
Measuring AOI inspection system gST seriesh

Measure and inspect after etching
Measuring AOI inspection system gST seriesh


FWet-etch Cu film
  Measure and inspect after stripping
Measuring AOI inspection system gST seriesh

GStrip photo-resist film


Stella Corporation Co., Ltd.
1-1544-7 Kaijincho Minami, Funabashi, Chiba, Japan Zip: 273-0024
Tel: +81-(0)47-432-5031
Fax: +81-(0)47-432-5032
e-Mail support@stellacorp.co.jp
http://www.stellacorp.co.jp