COF process flow |
Stella product |
TAB process flow |
Device structure
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Device structure
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①Draw up CAD data |
②Etch Cu film by half
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②Punch
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③Coat a photo-resist or laminate DFR
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③Laminate copper foil
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④Expose by UV light
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←Measure and inspect after exposure
Measuring ＆ AOI inspection system “ST series” |
④Coat a photo-resist or laminate DFR
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⑤Develop photo-resist film
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←Measure and inspect after development
Measuring ＆ AOI inspection system “ST series”
Measure and inspect after exposure→
Measuring ＆ AOI inspection system “ST series” |
⑤Expose by UV light
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⑥Wet-etch Cu film
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←Measure and inspect after etching
Measuring ＆ AOI inspection system “ST series”
Measure and inspect after development→
Measuring ＆ AOI inspection system “ST series” |
⑥Develop photo-resist film
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⑦Strip photo-resist film
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←Measure and inspect after stripping
Measuring ＆ AOI inspection system “ST series”
Measure and inspect after etching→
Measuring ＆ AOI inspection system “ST series” |
⑦Wet-etch Cu film
 |
| |
Measure and inspect after stripping→
Measuring ＆ AOI inspection system “ST series” |
⑧Strip photo-resist film
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